Chip EQUIP Act
S 3301, the Chip EQUIP Act, restricts federal funding for semiconductor manufacturing projects using certain foreign-made equipment. It defines "ineligible semiconductor manufacturing equipment" as completed, fully assembled systems (like lithography or etching machines) manufactured, assembled, or refurbished by foreign entities of concern. The bill prohibits covered entities receiving federal assistance from procuring, installing, or using such equipment for 10 years, with limited waivers allowed if the equipment isn't available from U.S. or allied sources, meets export controls, or is deemed critical for national security. This directly affects companies and institutions receiving federal funds for semiconductor manufacturing.
Bill status
in committee
1 of 4 stages cleared
Introduction
Dec 2025
Committee Review
Floor Vote
President
Introduced Dec 2, 2025
Last action Dec 2, 2025
Floor votes
How they voted
No floor votes recorded yet.
Full legislative history
Actions timeline
Total actions
2
Key actions
0
Committee
1
Dec 2, 2025
Committee
Read twice and referred to the Committee on Commerce, Science, and Transportation.
upper
Dec 2, 2025
Introduced
Introduced in Senate
upper
1 primary · 2 co-sponsors
Sponsors
Role
Legislator
Party
State
District
P
Mark Kelly
DDemocratic
Co
Marsha Blackburn
RRepublican
Co
Tim Sheehy
RRepublican
Ask Maddy
·
AI policy assistant
Ask Maddy about S 3301
Scope: US
Hi! I can help you understand S 3301. What would you like to know?
Try one of these
i
Maddy answers using official bill text and legislative records. Always verify before sharing.
Sources cited inline